Flip Chip technology is the method for interconnecting semiconductor devices such as Integrated Circuit chips and Micro-electromechanical systems (MEMS) to external circuitry with solder bumps that have been deposited on the chip pads. The chip is then mounted on the external circuitry with its top side down and properly aligned such that its pads align with the matching pads on the external circuit. Flip Chip offers reduced size of the devices (as packaging density increases) and increased performance. It is cheaper than wire bonding as all the bonds form simultaneously. The Report ‘ Flip Chip Market is segmented into six verticals, namely: By Joining Process, By Bumping Process, By Packaging, By Application, By End users and By Geography. The report is segmented by joining process into Solder joining, Thermo Compression, Thermo Sonic, Adhesive and few others. The report has been divided in terms of Bumping Processes like Copper Pillar, Lead-Free Solder, Tin-Lead eutectic solder, Gol...