Three-dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnects Market - Forecast(2022 - 2027)
Modern day electronics depend on the developments and the research, which goes into the manufacturing process of these electronics. The electronic components manufactured also play a pivotal role in the overall size and shape of the final product. In this regard, the development of Three-dimensional Integrated Circuit (3D IC Chip) and Through-Silicon Via (TSV) Interconnects has allowed device manufacturers to devise consumer electronic devices in a multitude of form factors whilst still ensuring the performance of the system is not affected by the size of the device itself. 3D IC packaging allows for more if not the same level of electronics to be integrated without any compromise on the form factor. In terms of revenue generation, the market is still very much in the early stages and can expect to see a considerable increase in adoption and revenue generation by the end of the forecast period. All the major semiconductor companies have already invested in 3D IC technology as well...